Bandao Microelectronics and SPEA Announced to Establish Strategic Cooperation

2023.05.30

On May 20th, Bandao Microelectronics (GJM) and SPEA announced that they had joined hands to reach a strategic cooperation agreement for strengthening the development of MEMS testing and calibration businesses in the mainland of China.

Combining GJM’s leading manufacturing service and quality management capacities with SPEA’s world-class testing technology and professional knowledge, this agreement is expected to accelerate the growth of the two companies’ proportion in China’s MEMS area, which is developing rapidly. This agreement has stipulated matters of close cooperation, aiming at developing and expanding the commercial map concerning the wafer test of MEMS sensors and actuators and calibration of packaging equipments. China’s electronic manufacturers seeking comprehensive OSAT services (including comprehensive testing solutions for MEMS and mixed signal components) will benefit greatly from this new strategic cooperation. It conforms to the core strategy of increasing the overall quality and reliability of products, and can reduce manufacturing and testing costs at the same time.

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